Test As You Go

By integrating test probes into the bed of the RepRap, and possibly using a wandering probe (single or multi-tip) attached to the deposition head, the assembled parts could be tested during the assembly process. Dud parts could then be either discarded or manually fixed.

PIC devices and similar could also be programmed in situ by the RepRap through these test connections rather than by first being placed in a programmer; the user need then only place the part once. A probe tip could also be used to break circuit links that are only required during the assembly process.